Title :
The advanced MEMS (aMEMS) process for fabricating wafer level vacuum packaged SOI-MEMS devices with embedded vertical feedthroughs
Author :
Torunbalci, M.M. ; Alper, S.E. ; Akin, T.
Author_Institution :
MEMS Res. & Applic. Center, Middle East Tech. Univ., Ankara, Turkey
Abstract :
This paper presents a novel, inherently simple and low-cost fabrication and hermetic packaging method developed for SOI-MEMS devices, where an SOI wafer is used for the fabrication of MEMS structures as well as vertical feedthroughs, while a glass cap wafer is used for hermetic encapsulation and routing metallization. Glass-to-silicon anodically bonded seals yield a very stable cavity pressure of 150 mTorr after 15 days. The shear strength of the fabricated packages is above 7 MPa. Temperature cycling and ultra-high temperature shock tests results in no degradation in the hermeticity of the packaged chips.
Keywords :
elemental semiconductors; encapsulation; glass; hermetic seals; metallisation; micromechanical devices; network routing; shear strength; silicon-on-insulator; wafer level packaging; MEMS structures; SOI wafer; Si; aMEMS process; advanced MEMS process; cavity pressure; embedded vertical feedthroughs; glass cap wafer; glass-to-silicon anodically bonded seals; hermetic encapsulation; hermetic packaging method; packaged chips; pressure 150 mtorr; routing metallization; shear strength; temperature cycling; time 15 day; ultra-high temperature shock tests; wafer level vacuum packaged SOI-MEMS devices; Bonding; Cavity resonators; Gettering; Glass; Metals; Micromechanical devices; Sensors; Advanced MEMS (aMEMS) process; anodic bonding; vertical feedthroughs; wafer level hermetic encapsulation;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
DOI :
10.1109/TRANSDUCERS.2015.7180963
