DocumentCode :
731766
Title :
Plasma-cavitation pencil cutter for powerful micro-processing
Author :
Arakawa, Y. ; Ohmura, M. ; Tsujimoto, D. ; Yamanishi, Y.
Author_Institution :
Shibaura Inst. of Technol., Tokyo, Japan
fYear :
2015
fDate :
21-25 June 2015
Firstpage :
521
Lastpage :
524
Abstract :
We have successfully developed novel processing equipment based on the combined of cavitation and plasma irradiation. This technique uses the strong points of the powerful ablation of cavitation as well as plasma irradiation. The novelty of the technique enable to process not only conductive material but also non-conductive material such as polymer, CFRP (carbon fiber reinforced plastic) and silicon, which is unlike conventional wire electric discharge machine. Also, the directional transportation of bubbles provides positioning accuracy of micro-processing. The structure of the plasma-cavitation pencil cutter is low cost and very simple structure. This technology contributes to effective processing of wide range of materials such as metal plate, polymer, carbon-fiber and biomaterials.
Keywords :
bubbles; cavitation; cutting tools; CFRP; bubbles directional transportation; carbon fiber reinforced plastic; cavitation ablation; metal plate; microprocessing; plasma irradiation; plasma-cavitation pencil cutter; polymer; processing equipment; silicon; Discharges (electric); Electron tubes; Glass; Plasmas; Polymers; Radiation effects; Wires; Ablation; Cavitation; Plasma; Processing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
Type :
conf
DOI :
10.1109/TRANSDUCERS.2015.7180975
Filename :
7180975
Link To Document :
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