Title :
Effect of current density on electroplated CoPt thick films
Author :
Oniku, O.D. ; Qi, B. ; Arnold, D.P.
Author_Institution :
Interdiscipl. Microsyst. Group, Univ. of Florida, Gainesville, FL, USA
Abstract :
In this paper, we report on the influence of electrodeposition current density on the structural and magnetic properties of plated equiatomic CoPt magnetic thick films. Films are electroplated using constant current density, ranging 25-200 mA/cm2, and subsequently annealed at 700°C for 40 min. It is found that electroplating current density has a strong influence over the plating rate, surface roughness, grain size, and order parameter. However, current density does not strongly affect the atomic composition of the plated film and only modestly influences the magnetic properties, namely coercivity. The films exhibit quasi-isotropic magnetic properties with the best results for a sample plated at 100 mA/cm2, yielding Hci = 900 kA/m, and in-plane squareness of 0.95 for a 3-μm-thick film having an rms surface roughness of 20 nm.
Keywords :
annealing; cobalt alloys; coercive force; current density; electroplating; grain size; magnetic thin films; metallic thin films; platinum alloys; surface roughness; CoPt; annealing; atomic composition; coercivity; electrodeposition current density; electroplated thick films; electroplating current density; grain size; plated equiatomic magnetic thick films; quasiisotropic magnetic properties; size 3 mum; structural properties; surface roughness; temperature 700 degC; time 40 min; Annealing; Current density; Magnetic films; Rough surfaces; Surface morphology; Surface roughness; CoPt; electroplating; magnetic MEMS; magnetic materials; microfabrication;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
DOI :
10.1109/TRANSDUCERS.2015.7180994
