DocumentCode :
73187
Title :
Fabrication of Micro-Polymer Lenses With Spacers Using Low-Cost Wafer-Level Glass-Silicon Molds
Author :
Shunjin Qin ; Jintang Shang ; Mengying Ma ; Li Zhang ; Chiming Lai ; Qing-An Huang ; Ching-Ping Wong
Author_Institution :
Key Lab. of MEMS of the Minist. of Educ., Southeast Univ., Nanjing, China
Volume :
3
Issue :
12
fYear :
2013
fDate :
Dec. 2013
Firstpage :
2006
Lastpage :
2013
Abstract :
A novel low-cost molding process to prepare polymer-based micro-lens arrays with spacers for optical applications was investigated in this paper. The process consists of the following steps: 1) hemispherical glass bubble arrays, used as the upper part of the molds, was prepared by combining a hot-forming process and a chemical-foaming process; 2) the silicon mold, used as the lower part of the molds, was fabricated by etching; 3) an anti-stick layer was coated on the concave surface of the glass mold; and 4) the lens material, UV-curable glue, was dispensed into the concave molds, followed by curing and de-molding. The optical properties of the lens were characterized by a profile meter and a beam analyzer. The results showed that the micro-polymer lens arrays with spacers were successfully prepared using the low-cost wafer-level glass-silicon mold. The results indicate that the micro-lenses have hemispherical structures and smooth surface.
Keywords :
curing; moulding; polymers; UV curable glue; antistick layer; beam analyzer; chemical foaming process; concave molds; concave surface; curing; demolding; etching; glass mold; hemispherical glass bubble arrays; hemispherical structures; hot forming process; lens material; low cost molding process; low cost wafer level glass silicon molds; micropolymer lens arrays; micropolymer lenses; optical applications; polymer based microlens arrays; profile meter; smooth surface; spacers; Glass; Lenses; Microoptics; Polymers; Silicon; Surface treatment; Wafer scale integration; Anti-stick treatment; UV molding; chemical-forming process (CFP); glass mold; hot-forming process (HFP); micro-lens arrays (MLAs); self-alignment structure; wafer-level package (WLP);
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2286162
Filename :
6650079
Link To Document :
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