A heat induced bi-layer lift-off method for flexible substrates

Author

Jia, Y. ; Cai, H. ; Lin, Q.

Author_Institution

Mech. Eng. Dept., Columbia Univ., New York, NY, USA

fYear

2015

fDate

21-25 June 2015

Firstpage

1259

Lastpage

1262

Abstract

This paper presents a microfabrication method that uses the reflow (i.e., heat induced photoresist deformation) of bi-layer sacrificial photoresists to allow rapid, complete lift-off of thick films on a flexible substrate. The simplicity and versatility of the method allows lift-off processing of thick films (> 50% thicker than the undercut photoresist layer) for the fabrication of low-electrical-resistance components in MEMS devices for applications such as thermoelectric power generation and sensing.

Keywords

flexible electronics; microfabrication; micromechanical devices; photoresists; thick films; MEMS device; bi-layer sacrificial photoresist reflow; flexible substrate; heat induced bilayer lift-off method; low-electrical-resistance component; microelectromechanical system; microfabrication method; thermoelectric power generation; thick film lift-off processing; Bismuth; Heating; Junctions; Resists; Substrates; Thick films; Lift-off; photoresist reflow; thermoelectric; thick metal films;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on

Conference_Location

Anchorage, AK

Type

conf

DOI

10.1109/TRANSDUCERS.2015.7181159

Filename

7181159