DocumentCode :
731897
Title :
Compact multifunctional test structure to measure the in-plane thermoelectric figure of merit ZT of thin films
Author :
Moser, D. ; Mueller, D. ; Paul, O.
Author_Institution :
Dept. of Microsyst. Eng. (IMTEK), Univ. of Freiburg, Freiburg, Germany
fYear :
2015
fDate :
21-25 June 2015
Firstpage :
1322
Lastpage :
1325
Abstract :
In response to recently renewed interest in thermoelectrics, this paper reports a novel compact, multifunctional test structure to measure the in-plane thermoelectric figure of merit ZT of thin films. All material parameters contributing to ZT = S2-1ρ-1 are determined on a single sample with dimensions of about 500×500 μm2. These are the Seebeck coefficient S, the thermal conductivity κ, and the electrical resistivity ρ. The method can be applied to thin films deposited at high temperature (T), such as poly-Si, and at low T, such as metal layers. We report the temperature-dependent ZT of n-doped poly-Si from 300 to 380 K, as well as the application of the device to Al thin films.
Keywords :
Seebeck effect; aluminium; electrical resistivity; elemental semiconductors; metallic thin films; semiconductor thin films; silicon; thermal conductivity; Al; Seebeck coefficient; Si; compact multifunctional test structure; electrical resistivity; in-plane thermoelectric figure of merit; temperature 300 K to 380 K; thermal conductivity; thin films; Conductivity; Fabrication; Films; Heating; Sensors; Temperature measurement; Thermal conductivity; Characterization; Figure of Merit; Poly-Si; Test Structure; Thermoelectric; Thin Film;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
Type :
conf
DOI :
10.1109/TRANSDUCERS.2015.7181175
Filename :
7181175
Link To Document :
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