• DocumentCode
    731902
  • Title

    A low-cost fabrication technique for direct sewing stretchable interconnetions for wearable electronics

  • Author

    Rahimi, R. ; Yu, W. ; Parupudi, T. ; Ochoa, M. ; Ziaie, B.

  • Author_Institution
    Purdue Univ., West Lafayette, IN, USA
  • fYear
    2015
  • fDate
    21-25 June 2015
  • Firstpage
    1350
  • Lastpage
    1353
  • Abstract
    Here, we present a facile method for rapid fabrication of low-cost, stretchable electrical interconnections for wearable electronics. Using a commercial sewing machine, thin metallic wires are sewn onto the wearable materials in a double-stitch zigzag pattern, with the second stitch being a water-soluble polyvinyl alcohol (PVA) thread. The stretchable pattern is secured onto a clothing (e.g., a glove) with a stretchable elastomer coating followed by dissolution of the PVA thread in water. The interconnections maintain a constant electrical conductivity for strains up to 50 % and bending cycles over 15000. As a proof of concept implementation, we sewed interconnects and a soft capacitive force sensor onto a latex glove to create a wearable tactile sensor with a linear sensitivity of 96 fF/N.
  • Keywords
    capacitive sensors; flexible electronics; integrated circuit interconnections; wearable computers; PVA thread; direct sewing stretchable interconnetions; fabrication technique; soft capacitive force sensor; stretchable electrical interconnections; water-soluble polyvinyl alcohol; wearable electronics; wearable tactile sensor; Capacitance; Fabrication; Force; Strain; Tactile sensors; Wires; Stretchable electronic; sewing; tactile; wearable;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
  • Conference_Location
    Anchorage, AK
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2015.7181182
  • Filename
    7181182