DocumentCode :
732019
Title :
Design and fabrication of curved silicon image planes for miniature monocentric imagers
Author :
Wu, T. ; Hamann, S.S. ; Ceballos, A. ; Solgaard, O. ; Howe, R.T.
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
fYear :
2015
fDate :
21-25 June 2015
Firstpage :
2073
Lastpage :
2076
Abstract :
We introduce the design and fabrication of a segmented, hemispherical silicon image plane for 10 mm-diameter spherical monocentric lens. In order to conform to the spherical focal plane of the lens, we create flexible gore patterns consisting of spring-connected silicon hexagons. Mechanical functionality is demonstrated by assembling 20 μm-thick, patterned silicon gores into a curved test fixture. We have also fabricated and tested a photodiode array in a CMOS compatible process. The hemispherical imager will enable a compact 160° field-of-view camera with a fill factor over 80% using a single spherical lens.
Keywords :
CMOS image sensors; assembling; elemental semiconductors; focal planes; integrated circuit testing; lenses; photodetectors; photodiodes; silicon; CMOS compatible process; Si; assembling; camera; curved test fixture; flexible pattern silicon gore; miniature monocentric imager; photodiode array; segmented hemispherical curved silicon image plane; single spherical monocentric lens; size 10 mm; size 20 mum; spherical focal plane; spring-connected silicon hexagon; CMOS integrated circuits; Imaging; Lenses; Photodiodes; Silicon; Stress; Surface treatment; Curved Image Plane; Monocentric Imager; Photodiode;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
Type :
conf
DOI :
10.1109/TRANSDUCERS.2015.7181365
Filename :
7181365
Link To Document :
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