• DocumentCode
    732019
  • Title

    Design and fabrication of curved silicon image planes for miniature monocentric imagers

  • Author

    Wu, T. ; Hamann, S.S. ; Ceballos, A. ; Solgaard, O. ; Howe, R.T.

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
  • fYear
    2015
  • fDate
    21-25 June 2015
  • Firstpage
    2073
  • Lastpage
    2076
  • Abstract
    We introduce the design and fabrication of a segmented, hemispherical silicon image plane for 10 mm-diameter spherical monocentric lens. In order to conform to the spherical focal plane of the lens, we create flexible gore patterns consisting of spring-connected silicon hexagons. Mechanical functionality is demonstrated by assembling 20 μm-thick, patterned silicon gores into a curved test fixture. We have also fabricated and tested a photodiode array in a CMOS compatible process. The hemispherical imager will enable a compact 160° field-of-view camera with a fill factor over 80% using a single spherical lens.
  • Keywords
    CMOS image sensors; assembling; elemental semiconductors; focal planes; integrated circuit testing; lenses; photodetectors; photodiodes; silicon; CMOS compatible process; Si; assembling; camera; curved test fixture; flexible pattern silicon gore; miniature monocentric imager; photodiode array; segmented hemispherical curved silicon image plane; single spherical monocentric lens; size 10 mm; size 20 mum; spherical focal plane; spring-connected silicon hexagon; CMOS integrated circuits; Imaging; Lenses; Photodiodes; Silicon; Stress; Surface treatment; Curved Image Plane; Monocentric Imager; Photodiode;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
  • Conference_Location
    Anchorage, AK
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2015.7181365
  • Filename
    7181365