DocumentCode :
733658
Title :
Chip-based silica microspheres for cavity optomechanics
Author :
Xuefeng Jiang ; Kuzyk, Mark ; Thein Oo ; Hailin Wang
Author_Institution :
Dept. of Phys., Univ. of Oregon, Eugene, OR, USA
fYear :
2015
fDate :
10-15 May 2015
Firstpage :
1
Lastpage :
2
Abstract :
We realized on-chip silica microspheres, featuring excellent thermal coupling to the silicon-wafer. These chip-based microspheres can overcome the problem of thermal bistability and are especially suitable for optomechanical studies in vacuum or at low temperature.
Keywords :
integrated optics; micro-optomechanical devices; microcavities; microfabrication; optical fabrication; silicon compounds; SiO2; cavity optomechanics; chip-based silica microspheres; low temperature; optomechanical studies; silicon wafer; thermal bistability; thermal coupling; vacuum; Optical bistability; Optical device fabrication; Optical fibers; Optical resonators; Silicon; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lasers and Electro-Optics (CLEO), 2015 Conference on
Conference_Location :
San Jose, CA
Type :
conf
Filename :
7184099
Link To Document :
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