DocumentCode :
734285
Title :
Virtual prototyping of heterogeneous dynamic platforms using Open Virtual Platforms
Author :
Masing, Leonard ; Werner, Stephan ; Becker, Jurgen
Author_Institution :
ITIV, Karlsruhe Inst. of Technol., Karlsruhe, Germany
fYear :
2015
fDate :
8-10 June 2015
Firstpage :
1
Lastpage :
4
Abstract :
Heterogeneous dynamic computing platforms are one of the big trends in today´s electronic world. These platforms typically feature different General-Purpose-Processors (GPP) combined with accelerators on a reconfigurable layer. However, this necessitates specialized programming models and an Operating System (OS) for dealing with the dynamicity. To allow the early development of the system software, the tool-chain and to help in the design space exploration, high-level simulations offer a possible solution. In this paper we evaluate the application of Open Virtual Platforms (OVP) for the modelling of a heterogeneous dynamic platform. The OVP high-level simulations are extended by introducing peripherals to model the abilities of such a platform. Specifically, a generic I/O device, a communication device for a distributed platform and an accelerator interface with a reconfigurable accelerator model is implemented and integrated into a simulated platform. Different approaches are presented and the insights and results gained during the development process are discussed regarding speed and applicability to the use case.
Keywords :
input-output programs; virtual prototyping; GPP; I/O device; OVP high-level simulations; Open Virtual Platforms; general-purpose-processors; heterogeneous dynamic computing platforms; operating system; reconfigurable accelerator model; virtual prototyping; Artificial intelligence; Computational modeling; Computer architecture; Delays; Hardware; Registers; Software; dynamic heterogeneous platform; high-level simulation; open virtual platforms (OVP); runtime adaptive systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Embedded Systems (SIES), 2015 10th IEEE International Symposium on
Conference_Location :
Siegen
Type :
conf
DOI :
10.1109/SIES.2015.7185053
Filename :
7185053
Link To Document :
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