DocumentCode
735312
Title
A 3D stacked CMOS image sensor with 16Mpixel global-shutter mode and 2Mpixel 10000fps mode using 4 million interconnections
Author
Kondo, Toru ; Takemoto, Yoshiaki ; Kobayashi, Kenji ; Tsukimura, Mitsuhiro ; Takazawa, Naohiro ; Kato, Hideki ; Suzuki, Shunsuke ; Aoki, Jun ; Saito, Haruhisa ; Gomi, Yuichi ; Matsuda, Seisuke ; Tadaki, Yoshitaka
Author_Institution
Olympus, Hachioji, Japan
fYear
2015
fDate
17-19 June 2015
Abstract
A 16Mpixel 3D stacked CMOS image sensor with pixel level interconnections using 4,008,960 micro bumps at a 7.6μm pitch, which set no layout restriction and causes no harm to sensor characteristics, was developed to achieve both a 16Mpixel global-shutter mode with a -180dB PLS and 2Mpixel 10000fps high speed image capturing mode.
Keywords
CMOS image sensors; image capture; integrated circuit interconnections; 3D stacked CMOS image sensor; complementary metal oxide semiconductor; global-shutter mode; high speed image capturing mode; micro bump; pixel level interconnection; Arrays; Image sensors; Integrated circuit interconnections; Photodiodes; Substrates; Three-dimensional displays; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Circuits (VLSI Circuits), 2015 Symposium on
Conference_Location
Kyoto
Print_ISBN
978-4-86348-502-0
Type
conf
DOI
10.1109/VLSIC.2015.7231335
Filename
7231335
Link To Document