DocumentCode
73706
Title
Physical Origins and Analysis of Negative-Bias Stress Instability Mechanism in Polymer-Based Thin-Film Transistors
Author
Jaewook Lee ; Jaeman Jang ; Hyeongjung Kim ; Jiyoul Lee ; Bang-Lin Lee ; Sung-Jin Choi ; Dong Myong Kim ; Dae Hwan Kim ; Kyung Rok Kim
Author_Institution
Sch. of Electr. Eng., Kookmin Univ., Seoul, South Korea
Volume
35
Issue
3
fYear
2014
fDate
Mar-14
Firstpage
396
Lastpage
398
Abstract
The physical origins of the negative-bias stress (NBS) instability in polymer-based thin-film transistors have been characterized. Through the quantitative analysis by TCAD simulation for the NBS time-dependent experimental results, the threshold voltage (VT)-shift by sub-bandgap density-of-states redistribution forms 70% and 78% for the measured total VT-shift while VT-shift by gate oxide charge trapping only takes 30% and 22% at NBS time of 3000 and 7000 s, respectively. In addition, the increase of source/drain Schottky contact resistance (RSD) is the main reason for NBS-induced on -current (ION) degradation.
Keywords
Schottky barriers; technology CAD (electronics); thin film transistors; NBS instability; NBS time-dependent experimental; NBS-induced on-current degradation; TCAD simulation; gate oxide charge trapping; negative-bias stress instability mechanism; physical origins; polymer-based thin-film transistors; source-drain Schottky contact resistance; subbandgap density-of-state redistribution; threshold voltage shift; Charge carrier processes; Degradation; Logic gates; NIST; Polymers; Stress; Transistors; Negative-bias stress; ON-current degradation; Schottky contact resistance; density-of-states; instability; polymer; redistribution; thin-film transistor; threshold voltage;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2014.2298861
Filename
6720145
Link To Document