Title :
Sub-mW
Dual-Input Injection-Locked Oscillator for Autonomous WBSNs
Author :
Kwan Wai Li ; Ka Nang Leung ; Leung, L.L.K.
Author_Institution :
Dept. of Electron. Eng., Chinese Univ. of Hong Kong, Shatin, China
fDate :
3/1/2013 12:00:00 AM
Abstract :
This paper presents a sub-mW, current-reused first-harmonic LC injection-locked oscillator (ILO) using in-phase dual-input injection technique. It can be used as a power oscillator in the injection-locked transmitter of wireless biomedical sensor nodes (WBSNs) integrated into a wireless body area network. A prototype chip, implemented in a standard 0.13-μm CMOS process occupying 200 × 380 μm, operates in the medical implantable communications service (MICS) band for medical implants. Measurement results show that the proposed ILO features a wide locking range of 800 MHz (150-950 MHz) at an input power of 0 dBm. More importantly, it has a high input sensitivity of -30 dBm to lock the 3-MHz bandwidth of the MICS band, while consuming only 660 μW at 1-V supply. This ultralow power consumption enables autonomous WBSNs.
Keywords :
CMOS analogue integrated circuits; LC circuits; biomedical electronics; biomedical telemetry; biomedical transducers; body area networks; body sensor networks; injection locked oscillators; low-power electronics; power integrated circuits; prosthetics; radio transmitters; CMOS process standard; ILO; MICS; autonomous WBSN; bandwidth 3 MHz; frequency 150 MHz to 950 MHz; in-phase dual-input injection technique; injection-locked transmitter; medical implantable communications service; power 660 muW; power oscillator; size 0.13 mum; submW current-reused first-harmonic LC dual-input injection-locked oscillator; ultralow power consumption; voltage 1 V; wireless biomedical sensor node; wireless body area network; Injection-locked oscillators; Modulation; Power demand; Transmitters; Wireless communication; Wireless sensor networks; Autonomous wireless biomedical sensor nodes (WBSNs); current reuse; dual-input injection; injection-locked oscillator;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2012.2189029