DocumentCode :
737736
Title :
Analytical Solutions for Distributed Interconnect Models—Part II: Arbitrary Input Response and Multicoupled Lines
Author :
Baghbanbehrouzian, Amirreza ; Masoumi, Nasser
Author_Institution :
Dept. of Electron. & Commun. Eng., Univ. of Tehran, Tehran, Iran
Volume :
23
Issue :
9
fYear :
2015
Firstpage :
1879
Lastpage :
1888
Abstract :
In this paper, a new method is presented to calculate the exact analytical solution of distributed RC, LC, and RLC interconnects with a random input at an arbitrary point through the line. The proposed method, based on a modified Duhamel theorem, is used to calculate the time-domain transient response of the initially conditioned interconnects. This method is applied to a line driven by ramp and exponential inputs. The new analytical solutions are expressed as an infinite summation of sinusoidal terms. However, a negligible worst case error of <;1% is observed for the expressions compared with HSPICE simulations for Fourier series with tens of terms. In addition, from these results a new model for transient response of a line considering the driver output resistance and capacitance is presented. Good accuracy is observed between the model and HSPICE simulations for various distributed interconnects and drivers. Furthermore, the developed solution is extended to include signal transient and crosstalk noise in multicoupled inductive-effect-prominent lines. In addition, arbitrary switching patterns for identical and nonidentical lines are investigated employing the new method and evaluated with HSPICE simulations.
Keywords :
SPICE; integrated circuit interconnections; transient response; HSPICE simulations; arbitrary input response; arbitrary switching patterns; crosstalk noise; distributed interconnect models; driver output capacitance; driver output resistance; modified Duhamel theorem; multicoupled inductive-effect-prominent lines; multicoupled lines; signal transient; time-domain transient response; Accuracy; Boundary conditions; Computational modeling; Integrated circuit interconnections; Mathematical model; Solid modeling; Transient response; Amir-Nasser (AMN) method; Fourier analysis; RLC interconnect; VLSI; VLSI.; distributed model; fourier analysis; initial conditions; multicoupled lines; signal integrity; time domain analysis; transmission line;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2014.2356432
Filename :
6932430
Link To Document :
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