Title :
Avalanche Capability of Vertical GaN p-n Junctions on Bulk GaN Substrates
Author :
Aktas, O. ; Kizilyalli, I.C.
Author_Institution :
Avogy Inc., San Jose, CA, USA
Abstract :
Inductive avalanche test results presented in this letter demonstrate that GaN p-n diodes can sustain single-pulse and repetitive inductive avalanche currents. The 0.36-mm2 vertical GaN p-n diodes can sustain single-pulse avalanche currents as high as 10 A. The safe zone of the single-pulse avalanche current is limited by peak pulse power and energy deposited in the device. The temperature-dependent behavior of the breakdown voltage and the reverse-voltage at onset of avalanche has a positive temperature coefficient. Repetitive avalanche ruggedness testing was performed by applying 105 pulses at 5-kHz frequency with increasing repetitive stress current. Based on a population of 63 devices, the incremental failure rate under repetitive avalanche current increases with increasing avalanche current. The devices that survive the step stress test sustain no parametric drift under repetitive avalanche.
Keywords :
III-V semiconductors; avalanche diodes; electric breakdown; gallium compounds; p-n junctions; wide band gap semiconductors; GaN; avalanche capability; breakdown voltage; bulk GaN substrates; frequency 5 kHz; inductive avalanche test; positive temperature coefficient; repetitive avalanche ruggedness testing; repetitive inductive avalanche currents; reverse-voltage; single-pulse avalanche currents; temperature-dependent behavior; vertical GaN p-n diodes; vertical GaN p-n junctions; Gallium nitride; Semiconductor diodes; Stress; Temperature dependence; Temperature measurement; Testing; Voltage measurement; Bulk GaN; PN diode; avalanche; avalanche ruggedness; vertical power semiconductors;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2015.2456914