DocumentCode :
738623
Title :
Electrothermal PSpice Modeling and Simulation of Power Modules
Author :
Raciti, Angelo ; Cristaldi, Davide ; Greco, Giuseppe ; Vinci, Giovanni ; Bazzano, Gaetano
Volume :
62
Issue :
10
fYear :
2015
Firstpage :
6260
Lastpage :
6271
Abstract :
Integrated power electronics modules (IPEMs) represent an innovative typology of power electronics assemblies able to guarantee several advantages such as increasing of power density, better management of the thermal flows, and a significant reduction of the package sizes. Their characteristics make them suitable for applications like motor drives or power conditioning. IPEM usage in emerging fields like hybrid automotive traction and electric generation from renewable energy sources is continuously increasing. In this paper, we describe the implementation of a devised flow to generate the layer-based electrothermal PSpice model of an IPEM and the simulation flow of the model. The proposed modeling methodology allows reducing an electrothermal multidomain problem to an electrical single one. The general PSpice-like nature of the proposed model makes it suitable for a wide range of simulation frameworks where the integration of heterogeneous multiphysics models could be a difficult task. The outlining of both electrical and thermal PSpice layers is discussed, and the implementation into the final model, by the assistance of custom electronic-design-automation flow, is presented. Moreover, we describe the validation procedure of the proposed approach, and the results are compared with the ones obtained by a commercial finite-element-based package used as a benchmark. Two simulation approaches related to specific conversion systems, and related issues, are presented and discussed.
Keywords :
Analytical models; Finite element analysis; Heating; Integrated circuit modeling; Mathematical model; SPICE; Solid modeling; Discrete power device; EDA/CAD methodologies; IPEM; MOSFET modeling; Thermal analysis; discrete power device; electronic design automation (EDA)/computer-aided design (CAD) methodologies; integrated power electronics modules (IPEMs); layered approach; thermal analysis; thermal impedance; thermal-impedance;
fLanguage :
English
Journal_Title :
Industrial Electronics, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0046
Type :
jour
DOI :
10.1109/TIE.2015.2420672
Filename :
7081374
Link To Document :
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