Dielectric Characterization of Ultra-Thin Low-Loss Build-Up Substrate for System-in-Package (SiP) Modules

This work proposes a method based on microstrip multi-size T-resonators to increase the accuracy of extracted dielectric characteristics. The dielectric characteristics of an ultra-thin and low-loss build-up substrate for system-in-package modules are obtained, which closely correspond to the measured S-parameters. An electromagnetic simulation is performed to verify the extracted dielectric characteristics. The proposed method is also used to improve the accuracy of prediction of far-field radiated emission at resonant frequencies from a microstrip component.