• DocumentCode
    739218
  • Title

    A Submillimeter Wave InP HEMT Multiplier Chain

  • Author

    Zamora, Alexis ; Mei, Gerry ; Leong, Kevin M. K. H. ; Lange, Mike ; Lee, Jane ; Yoshida, Wayne ; Gorospe, Ben S. ; Padilla, Jose G. ; Deal, William R.

  • Author_Institution
    Northrop Grumman Corp., Redondo Beach, CA, USA
  • Volume
    25
  • Issue
    9
  • fYear
    2015
  • Firstpage
    591
  • Lastpage
    593
  • Abstract
    In this letter, we demonstrate the first 400 GHz multiplier chain with integrated buffer amplifiers through the chain. The x9 multiplier chain uses 25 nm InP HEMT MMIC technology. The chain consists of three packaged MMICs in split-block waveguide packages with each multiplier incorporating an integrated output buffer. We report a peak output of 6.9 mW and greater than 4 mW over a 10% bandwidth.
  • Keywords
    HEMT integrated circuits; III-V semiconductors; field effect MMIC; frequency multipliers; indium compounds; submillimetre wave amplifiers; InP; MMIC technology; frequency 400 GHz; integrated buffer amplifier; packaged MMIC; power 6.9 mW; size 25 nm; submillimeter wave HEMT multiplier chain; Gain; HEMTs; III-V semiconductor materials; Indium phosphide; MMICs; Power generation; Radio frequency; HEMT; InP; multiplier chain; source; submillimeter; terahertz (THz);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2015.2451364
  • Filename
    7169625
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=739218