Title :
Mutual Synchronization for Power Generation and Beam-Steering in CMOS With On-Chip Sense Antennas Near 200 GHz
Author :
Sengupta, Kaushik ; Hajimiri, Ali
Author_Institution :
Dept. of Electr. Eng., Princeton Univ., Princeton, NJ, USA
Abstract :
In this paper, we introduce the concept of near-field synchronization as an efficient, scalable, and robust method to synchronize a 2-D array of mutually coupled oscillators for beam-forming at frequencies above fmax of a technology. The method employs an array of on-chip sense antennas to probe electromagnetic near-fields of the on-chip radiators. These sense antennas are then coupled to each other appropriately through a network that establishes the synchronized state as the lowest energy state. A circuit-electromagnetic co-design methodology is employed to demonstrate beam-steering near 200 GHz with a synchronized 2 × 2 array. Each element of the array is a traveling-wave oscillator with the nonlinear active devices selectively radiating its second harmonic through the same electromagnetic structure. The beam-pattern can be varied by more than 70° in both azimuth and elevation. The chip is realized in 65-nm bulk CMOS.
Keywords :
CMOS integrated circuits; array signal processing; beam steering; field effect MIMIC; millimetre wave antenna arrays; millimetre wave oscillators; near-field communication; synchronisation; 2D array; beam steering; beam-forming; beam-pattern; bulk CMOS; circuit-electromagnetic co-design; electromagnetic near-fields; electromagnetic structure; mutual synchronization; mutually coupled oscillators; near-field synchronization; nonlinear active devices; on-chip radiators; on-chip sense antennas; power generation; size 65 nm; synchronized array; traveling wave oscillator; Antenna radiation patterns; Arrays; Couplings; Harmonic analysis; Oscillators; Synchronization; Beam-forming; CMOS; beam-steering; millimeter wave; near-field; on-chip antenna; power combining; power generation; substrate modes; terahertz;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2015.2457902