Back-End Deposited Silicon Photonics for Monolithic Integration on CMOS

Author

Lee, Y.H.D. ; Lipson, Michal

Author_Institution

Dept. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA

Volume

19

Issue

2

fYear

2013

Firstpage

8200207

Lastpage

8200207

Abstract

We present the vision of back-end deposited silicon photonics (BDSP) and review works that have been done in this field. Individual aspects of BDSP platform including excimer-laser-annealed polycrystalline silicon, low-loss plasma-enhanced chemical vapor deposition silicon nitride waveguide, modulator, detector, electrical interface, back-end CMOS compatibility, and benefits of the platform are discussed in detail.

Keywords

CMOS integrated circuits; elemental semiconductors; excimer lasers; laser beam annealing; plasma CVD; silicon; BDSP platform; Si; back-end CMOS compatibility; back-end deposited silicon photonics; detector; electrical interface; excimer-laser-annealed polycrystalline silicon; low-loss plasma-enhanced chemical vapor deposition silicon nitride waveguide; modulator; monolithic integration; CMOS integrated circuits; Optical losses; Optical ring resonators; Optical waveguides; Photonics; Silicon; Silicon compounds; CMOS technology; excimer laser annealing (ELA); integrated optics; optical modulators; photodetectors; polycrystalline silicon; silicon nitride (SiN); silicon photonics (SiP);

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2012.2209865

Filename

6259826