Title :
Analysis of Active-Clamp Response to Power-On ESD: Power Supply Integrity and Performance Tradeoffs
Author :
Mertens, Robert ; Thomson, Nicholas ; Yang Xiu ; Rosenbaum, Elyse
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
An active rail clamp circuit provides protection against component-level ESD; this work explores the challenges associated with designing a rail clamp to additionally provide protection when the IC is powered on. The fast transient response required to protect against ESD makes it difficult to design a stable circuit and introduces tradeoffs between supply integrity and the clamping characteristic. This work presents an analysis of how these performance metrics are affected by device sizes. Interactions between a rail clamp circuit, which may be an active or passive clamp, and the parasitic elements of the package and board are examined; it is shown that these interactions may briefly power down the supply.
Keywords :
clamps; electrostatic discharge; integrated circuit design; integrated circuit packaging; integrated logic circuits; logic design; transient response; trigger circuits; IC; active clamp; active rail clamp circuit; active-clamp response; clamping characteristic; component-level ESD; electrostatic discharge; integrated circuits; parasitic elements; passive clamp; power supply integrity; power-on ESD; transient response; Circuit stability; Clamps; Electrostatic discharges; Impedance; Rails; Stability analysis; Trigger circuits; Circuit Stability; Circuit stability; Electromagnetic Compatibility; Electrostatic Discharge; Immunity Testing; Integrated Circuit Reliability; System-Level ESD; electromagnetic compatibility; electrostatic discharge; immunity testing; integrated circuit reliability; system-level ESD;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2015.2464222