Title :
A Wide-Band CMOS to Waveguide Transition at mm-Wave Frequencies With Wire-Bonds
Author :
Jameson, Samuel ; Socher, Eran
Author_Institution :
Sch. of Electr. Eng., Tel Aviv Univ., Tel Aviv, Israel
Abstract :
In this paper a two-step transition between a CMOS chip and a WR-10 waveguide is investigated. The transition between a coplanar waveguide (CPW) on Duroid to W-band aluminum waveguide is studied and measured results show a bandwidth of 49% (67-110 GHz), an average insertion loss of 0.35 dB, and return loss below -10 dB throughout the entire band. Wire-bonding is then investigated as a connection between on-chip CMOS ground-signal-ground (GSG) pads to the Duroid CPW where the CMOS to printed circuit board transition measured results show an average 1-dB loss (including the CMOS GSG launcher) in the W-band. The full transition is also used to demonstrate packaging of a 100-GHz voltage-controlled oscillator in 90-nm CMOS where the RF signal was transmitted successfully with an average 2.5-dB loss (which includes a 2-cm Duroid CPW line) compared to on-chip probing measurement results.
Keywords :
CMOS integrated circuits; aluminium; coplanar waveguides; field effect MIMIC; lead bonding; millimetre wave oscillators; printed circuits; voltage-controlled oscillators; waveguide transitions; Al; CMOS GSG launcher; CMOS chip; Duroid aluminum waveguide; W-band aluminum waveguide; WR-10 waveguide; coplanar waveguide; frequency 67 GHz to 110 GHz; mm-wave frequency; on-chip CMOS ground-signal-ground pads; packaging; printed circuit board transition; size 90 nm; two-step transition; voltage-controlled oscillator; waveguide transition; wideband CMOS; wire bonds; Antennas; Bandwidth; CMOS integrated circuits; Coplanar waveguides; Impedance; System-on-chip; Waveguide transitions; CMOS; W-band; coplanar waveguide (CPW); millimeter-wave (mm-wave); package; printed circuit board (PCB); transition; waveguide; wire-bond;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2015.2461160