Title :
Characteristics of Polycrystalline Si Thin Film—Solid Solubility and Mobility Study
Author_Institution :
Micron Technol. Inc., Boise, ID, USA
Abstract :
Carrier solid solubility (SS) and mobility of polycrystalline silicon (poly-Si) thin film as the functions of the doping ion species and annealing conditions (temperature and time) are characterized. The study of SS and mobility shows that the poly-Si thin film has lower chemical SS and electrically active SS and much lower mobility (μ) than a single-crystalline Si substrate, because polygrain boundaries dominate carrier scattering mechanism. For the poly-Si thin film, doping ion species show relatively less impact on SS and mobility data, but annealing thermal budgets (temperature and time) show more impact on SS and mobility data.
Keywords :
annealing; carrier mobility; elemental semiconductors; grain boundaries; semiconductor doping; semiconductor thin films; silicon; solubility; Si; annealing; carrier scattering mechanism; carrier solid mobility; carrier solid solubility; doping ion species; polycrystalline silicon thin film; polygrain boundaries; single-crystalline substrate; Annealing; Cascading style sheets; Grain size; Implants; Impurities; Silicon; Temperature measurement; Grain boundary; mobility; polycrystalline silicon (poly-Si) thin film; polygrain size; solid solubility (SS); solid solubility (SS).;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2015.2454441