Book review

The 2.5D/3D stacking of memory and processor chips with through-silicon via connections is part of a long trend toward performance improvement and cost reduction of memories and memory system chips and is becoming not only an engineering reality in the integrated circuit industrial real world but also a hot topic for the EMC/SI scientific community as demonstrated by the increasing number of papers on this topic published in the IEEE Transactions on Electromagnetic Compatibility. The majority of these papers deal with challenging electromagnetic modeling issues leaving in the background the impact that the manufacturing technology can have on the modeling itself.