DocumentCode :
740274
Title :
Message from the symposium general chair 2015 IEEE symposium on electromagnetic compatibility and signal integrity
Author :
Chan, Caroline
Volume :
4
Issue :
2
fYear :
2015
Firstpage :
50
Lastpage :
50
Abstract :
I would like to thank YOU — all the 1,400+ attendees, exhibitors, volunteers — who came to Santa Clara for the 2015 IEEE Symposium on EMC and SI. You brought us success in the famous Silicon Valley. We started with the registration on Sunday by distributing the awesome grocery insulation bags that the team had chosen this year. This was the obvious choice as you have to bring your own bags for grocery shopping in California.
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility Magazine, IEEE
Publisher :
ieee
ISSN :
2162-2264
Type :
jour
DOI :
10.1109/MEMC.2015.7204049
Filename :
7204049
Link To Document :
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