DocumentCode :
74215
Title :
Self-Assembly Kinetics of Microscale Components: A Parametric Evaluation
Author :
Carballo, Jose M. ; Crane, Nathan B.
Author_Institution :
Dept. of Mech. Eng., Univ. of South Florida, Tampa, FL, USA
Volume :
24
Issue :
4
fYear :
2015
fDate :
Aug. 2015
Firstpage :
839
Lastpage :
847
Abstract :
At the microscale, assembly by grasp and release is challenging. Self-assembly (SA) is an alternative component assembly method to significantly reduce assembly equipment costs. However, successful application of SA requires high assembly rates and high yield (few process errors). Prior modeling efforts describe SA process performance (yield and rate) for specific system configurations, but they do not use measurable process parameters and provide limited ability to predict the impact of process changes. In this paper, an experimental SA system was designed that controls process parameters independently while measuring SA outcomes. This system is used to evaluate a simple parameterization model for SA rate. The travel direction of the parts is varied to measure the path dependence of the assembly probability in the limit of low-impact velocity. Moreover, effects from changing part geometry are evaluated and accounted for in the model. Experimental results show a strong part-geometry dependence and minimal dependence on part arrival angle. This information is a key step toward a parametric kinetic model of capillary SA and complements previous SA process modeling efforts.
Keywords :
micromechanical devices; self-assembly; assembly equipment costs; assembly probability; component assembly method; microscale components; parametric evaluation; process changes; process errors; process parameters; self-assembly kinetics; Assembly; Bonding; Equations; Geometry; Kinetic theory; Liquids; Mathematical model; Electronics packaging; measurement; microassembly; modeling; performance evaluation; self-assembly; surface tension;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2014.2354137
Filename :
6901223
Link To Document :
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