A Wideband Bond-Wire Antenna for Millimeter Wave Intra-Communication Systems

Author

Yugang Ma ; Kawasaki, Keisuke ; Masuda, Hiroji

Author_Institution

Singapore Res. Lab., Sony Electron., Singapore, Singapore

Volume

61

Issue

9

fYear

2013

Firstpage

4839

Lastpage

4843

Abstract

A compact and wideband millimeter wave bond-wire antenna (BWA) is proposed for consumer product intra-communications. The antenna consists of two 0.8 mm long wires in front of the ground plane. Its impedance bandwidth is 29 GHz (37 GHz to 66 GHz). It has 2 dBi average gain. After introducing the bandwidth widening solution to a wire antenna, the new BWA structure is presented. The antenna parameters including the impedance bandwidth, the radiation pattern and the gain versus frequency were simulated and compared with measured results. The proposed BWA was implemented in a CMOS integrated circuit (IC) millimeter communication system. 11 Gb/s wireless data transmission was achieved by using a part of the bandwidth of the proposed BWA.

Keywords

broadband antennas; BWA structure; CMOS integrated circuit millimeter communication system; bandwidth widening solution; consumer product intracommunications; impedance bandwidth; millimeter wave intracommunication systems; radiation pattern; wideband millimeter wave bond wire antenna; wireless data transmission; Bond-wire; bond-wire antenna (BWA); millimeter wave communications; monopole antenna; package antenna and wideband antenna;

fLanguage

English

Journal_Title

Antennas and Propagation, IEEE Transactions on

Publisher

ieee

ISSN

0018-926X

Type

jour

DOI

10.1109/TAP.2013.2264478

Filename

6517860