Title :
A Wideband Bond-Wire Antenna for Millimeter Wave Intra-Communication Systems
Author :
Yugang Ma ; Kawasaki, Keisuke ; Masuda, Hiroji
Author_Institution :
Singapore Res. Lab., Sony Electron., Singapore, Singapore
Abstract :
A compact and wideband millimeter wave bond-wire antenna (BWA) is proposed for consumer product intra-communications. The antenna consists of two 0.8 mm long wires in front of the ground plane. Its impedance bandwidth is 29 GHz (37 GHz to 66 GHz). It has 2 dBi average gain. After introducing the bandwidth widening solution to a wire antenna, the new BWA structure is presented. The antenna parameters including the impedance bandwidth, the radiation pattern and the gain versus frequency were simulated and compared with measured results. The proposed BWA was implemented in a CMOS integrated circuit (IC) millimeter communication system. 11 Gb/s wireless data transmission was achieved by using a part of the bandwidth of the proposed BWA.
Keywords :
broadband antennas; BWA structure; CMOS integrated circuit millimeter communication system; bandwidth widening solution; consumer product intracommunications; impedance bandwidth; millimeter wave intracommunication systems; radiation pattern; wideband millimeter wave bond wire antenna; wireless data transmission; Bond-wire; bond-wire antenna (BWA); millimeter wave communications; monopole antenna; package antenna and wideband antenna;
Journal_Title :
Antennas and Propagation, IEEE Transactions on
DOI :
10.1109/TAP.2013.2264478
