Title :
The Design of Broadband 60 GHz AMC Antenna in Multi-Chip RF Data Transmission
Author :
Ho-Hsin Yeh ; Hiramatsu, N. ; Melde, Kathleen L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA
fDate :
4/1/2013 12:00:00 AM
Abstract :
This paper presents the design of a 60 GHz antenna to be used in multi-core multi-chip (MCMC) computing systems. The antenna in package (AiP) solution has a ground-shielded metal and a periodically-patched artificial magnetic conductor (AMC) structure to widen the reflection coefficient bandwidth. The designed antenna with AMC layer broadcasts signals in the horizontal direction. Both simulated and measured results demonstrate that a -10 dB reflection coefficient is achieved for a 10 GHz bandwidth and that radiation in the horizontal (chip-to-chip) direction is maintained.
Keywords :
broadband antennas; electronics packaging; millimetre wave antennas; millimetre wave integrated circuits; multichip modules; AMC layer broadcast signals; AMC structure; AiP solution; MCMC computing systems; antenna in package solution; bandwidth 10 GHz; broadband AMC antenna; ground-shielded metal; horizontal direction; multichip RF data transmission; multichip module; multicore multichip computing systems; periodically-patched artificial magnetic conductor structure; reflection coefficient bandwidth; Antenna measurements; Antennas; Bandwidth; Conductors; Dielectrics; Silicon; 60 GHz antennas; Antenna-in-package; electronic packaging; printed antenna;
Journal_Title :
Antennas and Propagation, IEEE Transactions on
DOI :
10.1109/TAP.2012.2232895
