• DocumentCode
    743713
  • Title

    Lifetime Evaluation of Nanoscale Silver Sintered Power Modules for Automotive Application Based on Experiments and Finite-Element Modeling

  • Author

    Le Henaff, F. ; Azzopardi, S. ; Woirgard, E. ; Youssef, T. ; Bontemps, S. ; Joguet, J.

  • Author_Institution
    Alpha Metals Loetsysteme GmbH, Langenfeld, Germany
  • Volume
    15
  • Issue
    3
  • fYear
    2015
  • Firstpage
    326
  • Lastpage
    334
  • Abstract
    The thermomechanical behavior of power modules has been always an issue with regard to reliability improvement. Silver sintering technology is one of the few alternatives for die attachment, which could bring a longer operating lifetime. Finite-element modeling (FEM) is as critical as the experimental development for such a new technology. In this paper, we present a lifetime evaluation approach for power modules used in automotive applications due to thermal characterizations, thermal ageing, and thermomechanical FEM analyses. A lower coefficient of thermal expansion mismatch with the silver sintering technology as compared with soldering increases the thermomechanical resistance to thermal swings (about six times). The FEM analyses of the accumulation of the strain energy density help understand and locate the high-stress area in a silver-sintered power module. Finally, this paper leads us to estimate the operating lifetime of silver-sintered assemblies for a specific mission profile by considering the thermomechanical behavior.
  • Keywords
    ageing; automotive electronics; finite element analysis; microassembling; power electronics; reliability; silver; sintering; thermal expansion; thermomechanical treatment; Ag; automotive application; die attachment; finite element modeling; lifetime evaluation; nanoscale silver sintered power modules; reliability improvement; strain energy density; thermal ageing; thermal characterizations; thermal expansion mismatch; thermal swings; thermomechanical FEM analysis; thermomechanical resistance; Finite element analysis; Multichip modules; Silver; Thermal resistance; Thermomechanical processes; Vehicles; FEM analysis; Silver sintering; die-attach; lifetime evaluation; power packaging; power packaging, FEM analysis; reliability; thermomechanical behavior;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2015.2443055
  • Filename
    7120940