• DocumentCode
    74408
  • Title

    On Improving the Performance of a Triaxis Vortex Convective Gyroscope Through Suspended Silicon Thermistors

  • Author

    Honglong Chang ; Xianghui Gong ; Shasha Wang ; Pingwei Zhou ; Weizheng Yuan

  • Author_Institution
    Key Lab. of Micro & Nano Syst. for Aerosp., Northwestern Polytech. Univ., Xi´an, China
  • Volume
    15
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    946
  • Lastpage
    955
  • Abstract
    This paper reports on a triaxis vortex convective gyroscope, in which a suspended arch-shaped silicon thermistor is proposed to improve performance by reducing the thermal-induced stress and heat dissipation to the substrate. The arch structure of the thermistor reduced the thermal-induced stress up to 88.7% compared with the clamped-clamped structure of the thermistor in our previous study. The suspended state reduced the heat dissipation to the substrate up to 32%. The experimental test results indicated that the sensitivities of the sensor for the x-axis, y-axis, and z-axis gyroscope were 0.642, 0.528, and 0.241 mV/°/s, respectively. The sensitivity improvement reached 49.65%, 56.21%, and 51.57% for each axis. The measured nonlinearity for the x-axis, y-axis, and z-axis gyroscope were 2.1%, 3.8%, and 4.5% in the range of ±100 °/s, respectively. An improvement in the linearity of 23.53%, 36.67%, and 6.25% was obtained.
  • Keywords
    convection; cooling; elemental semiconductors; gyroscopes; silicon; suspensions; temperature measurement; temperature sensors; thermal stresses; thermistors; vortices; Si; clamped-clamped structure; heat dissipation; sensor; suspended arch-shaped silicon thermistor; thermal-induced stress reduction; triaxis vortex convective gyroscope; x-axis gyroscope; y-axis gyroscope; z-axis gyroscope; Gyroscopes; Heating; Stress; Thermal sensors; Thermal stresses; Thermistors; Gyroscope; MEMS; heat conduction losses; thermal-induced stress; thermistors;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2014.2358700
  • Filename
    6901238