DocumentCode
74408
Title
On Improving the Performance of a Triaxis Vortex Convective Gyroscope Through Suspended Silicon Thermistors
Author
Honglong Chang ; Xianghui Gong ; Shasha Wang ; Pingwei Zhou ; Weizheng Yuan
Author_Institution
Key Lab. of Micro & Nano Syst. for Aerosp., Northwestern Polytech. Univ., Xi´an, China
Volume
15
Issue
2
fYear
2015
fDate
Feb. 2015
Firstpage
946
Lastpage
955
Abstract
This paper reports on a triaxis vortex convective gyroscope, in which a suspended arch-shaped silicon thermistor is proposed to improve performance by reducing the thermal-induced stress and heat dissipation to the substrate. The arch structure of the thermistor reduced the thermal-induced stress up to 88.7% compared with the clamped-clamped structure of the thermistor in our previous study. The suspended state reduced the heat dissipation to the substrate up to 32%. The experimental test results indicated that the sensitivities of the sensor for the x-axis, y-axis, and z-axis gyroscope were 0.642, 0.528, and 0.241 mV/°/s, respectively. The sensitivity improvement reached 49.65%, 56.21%, and 51.57% for each axis. The measured nonlinearity for the x-axis, y-axis, and z-axis gyroscope were 2.1%, 3.8%, and 4.5% in the range of ±100 °/s, respectively. An improvement in the linearity of 23.53%, 36.67%, and 6.25% was obtained.
Keywords
convection; cooling; elemental semiconductors; gyroscopes; silicon; suspensions; temperature measurement; temperature sensors; thermal stresses; thermistors; vortices; Si; clamped-clamped structure; heat dissipation; sensor; suspended arch-shaped silicon thermistor; thermal-induced stress reduction; triaxis vortex convective gyroscope; x-axis gyroscope; y-axis gyroscope; z-axis gyroscope; Gyroscopes; Heating; Stress; Thermal sensors; Thermal stresses; Thermistors; Gyroscope; MEMS; heat conduction losses; thermal-induced stress; thermistors;
fLanguage
English
Journal_Title
Sensors Journal, IEEE
Publisher
ieee
ISSN
1530-437X
Type
jour
DOI
10.1109/JSEN.2014.2358700
Filename
6901238
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