• DocumentCode
    744505
  • Title

    Optical Multilevel Signaling for High Bandwidth and Power-Efficient On-Chip Interconnects

  • Author

    Tzyy-Juin Kao ; Louri, Ahmed

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA
  • Volume
    27
  • Issue
    19
  • fYear
    2015
  • Firstpage
    2051
  • Lastpage
    2054
  • Abstract
    The scalability of high-performance computing systems is increasingly dependent on high-bandwidth and power-efficient communication between a growing number of processing cores on- and off-chip. Recent developments in silicon photonics technology can potentially alleviate many of the challenges associated with these stringent interconnection demands. In this letter, we propose the use of an optical multilevel signaling technique for on-chip interconnects in conjunction with wavelength division multiplexing to double the aggregate communication bandwidth without increasing the number of waveguides and wavelengths used, thereby reducing scaling costs.
  • Keywords
    elemental semiconductors; integrated optics; optical communication equipment; optical information processing; optical interconnections; silicon; wavelength division multiplexing; Si; high bandwidth on-chip interconnects; high-bandwidth communication; high-performance computing systems; optical multilevel signaling technique; power-efficient communication; power-efficient on-chip interconnects; silicon photonics technology; wavelength division multiplexing; Bandwidth; Modulation; Optical waveguides; Receivers; Ring lasers; System-on-chip; Waveguide lasers; Optical interconnections; amplitude shift keying; photonic integrated circuits;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2015.2450177
  • Filename
    7134732