DocumentCode
744505
Title
Optical Multilevel Signaling for High Bandwidth and Power-Efficient On-Chip Interconnects
Author
Tzyy-Juin Kao ; Louri, Ahmed
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Arizona, Tucson, AZ, USA
Volume
27
Issue
19
fYear
2015
Firstpage
2051
Lastpage
2054
Abstract
The scalability of high-performance computing systems is increasingly dependent on high-bandwidth and power-efficient communication between a growing number of processing cores on- and off-chip. Recent developments in silicon photonics technology can potentially alleviate many of the challenges associated with these stringent interconnection demands. In this letter, we propose the use of an optical multilevel signaling technique for on-chip interconnects in conjunction with wavelength division multiplexing to double the aggregate communication bandwidth without increasing the number of waveguides and wavelengths used, thereby reducing scaling costs.
Keywords
elemental semiconductors; integrated optics; optical communication equipment; optical information processing; optical interconnections; silicon; wavelength division multiplexing; Si; high bandwidth on-chip interconnects; high-bandwidth communication; high-performance computing systems; optical multilevel signaling technique; power-efficient communication; power-efficient on-chip interconnects; silicon photonics technology; wavelength division multiplexing; Bandwidth; Modulation; Optical waveguides; Receivers; Ring lasers; System-on-chip; Waveguide lasers; Optical interconnections; amplitude shift keying; photonic integrated circuits;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2015.2450177
Filename
7134732
Link To Document