• DocumentCode
    745090
  • Title

    Utilizing the effect of relative delay on energy dissipation in low-power on-chip buses

  • Author

    Ghoneima, Maged ; Ismail, Yehea I.

  • Author_Institution
    Electr. & Comput. Eng. Dept., Northwestern Univ., Evanston, IL, USA
  • Volume
    12
  • Issue
    12
  • fYear
    2004
  • Firstpage
    1348
  • Lastpage
    1359
  • Abstract
    This paper presents an analysis of how the power dissipation of on-chip buses is affected by introducing a relative delay between the switching lines. Relative delay is shown to reduce the dissipated power of oppositely switching lines while causing a power penalty for similarly switching lines. A new low-power bus scheme that uses this effect is proposed and analyzed. As the introduced delay increases, the achieved power reduction increases while decreasing the bus throughput. Thus, a tradeoff between power reduction and throughput is required when selecting the imposed relative delay. The proposed low-power scheme, dynamic delayed line bus (DDL) scheme, led to a power reduction of up to 25%, 33%, and 42% when applied to data, address, and differential buses, respectively. Simple DDL hardware is designed and implemented in a 0.18-/spl mu/m TSMC CMOS technology and applied to a 4500-/spl mu/m long Metal4 bus. Circuit simulation results for different bus widths are presented.
  • Keywords
    CMOS integrated circuits; circuit simulation; delays; integrated circuit interconnections; system buses; 0.18 micron; 4500 micron; Metal4 bus; TSMC CMOS technology; bus throughput; circuit simulation; dynamic delayed line bus; energy dissipation; low power onchip buses; low power scheme; power reduction; relative delay; switching lines; CMOS technology; Capacitance; Delay effects; Delay lines; Encoding; Energy dissipation; Integrated circuit technology; Personal digital assistants; Power dissipation; Throughput; Coupling capacitance; interconnect; low power; on-chip buses;
  • fLanguage
    English
  • Journal_Title
    Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1063-8210
  • Type

    jour

  • DOI
    10.1109/TVLSI.2004.837993
  • Filename
    1407953