Title :
A novel approach for generating boundary condition independent compact dynamic thermal networks of packages
Author :
Codecasa, Lorenzo
Author_Institution :
Dipt. di Elettronica e Inf., Politecnico di Milano, Italy
Abstract :
A novel approach is proposed for generating compact dynamic thermal models of packages, independent on boundary conditions. This approach is based on the novel definition of Robin´s boundary condition independent dynamic thermal network and on the application of a novel multivariate moment matching method. The resulting compact thermal models are more accurate than compact models obtained by means of previous methods.
Keywords :
chip scale packaging; semiconductor device models; semiconductor device packaging; thermal management (packaging); boundary condition; compact thermal models; independent dynamic thermal network; multivariate moment matching method; thermal packages networks; Boundary conditions; Capacitance; Disruption tolerant networking; Equations; Network topology; Packaging; Partitioning algorithms; Thermal resistance; Compact thermal model; multivariate moment matching method;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.859742
