DocumentCode :
745669
Title :
High-precision compact-thermal models
Author :
Sabry, Mohamed-Nabil
Author_Institution :
Univ. Francaise d´´Egypte, Cairo, Egypt
Volume :
28
Issue :
4
fYear :
2005
Firstpage :
623
Lastpage :
629
Abstract :
Classical approaches proposed for the construction of compact-thermal models suffer from a common disadvantage. They provide no means for error control. Although it is evident that the more nodes we define on the surface, the higher will be the precision, there is no guidance as to the required number of nodes to be defined on the surface, as well as the best position and size to obtain a given precision. Intuitive approaches usually used would fail to deal with complex objects such as those having multiple independent heat sources [multichip modules (MCM)]. In this work, based on an original and generalized formulation of the Green´s function, a systematic approach is proposed to build the compact model that gives a better control of these errors, allowing thus the creation of compact models at any desired order of precision. It also gives access to new data concerning tangential gradients on the surface.
Keywords :
Green´s function methods; integrated circuit packaging; multichip modules; thermal analysis; thermal management (packaging); Greens function; error control; high-precision compact thermal models; multichip modules; multiple independent heat sources; tangential surface gradients; Boundary conditions; Context modeling; Equations; Error correction; Heat transfer; Multichip modules; Packaging; Performance analysis; Team working; Temperature; Compact-thermal models; precision;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2005.859666
Filename :
1546165
Link To Document :
بازگشت