• DocumentCode
    745690
  • Title

    Noncontact transient temperature mapping of active electronic devices using the thermoreflectance method

  • Author

    Burzo, Mihai G. ; Komarov, Pavel L. ; Raad, Peter E.

  • Author_Institution
    Mech. Eng. Dept., Southern Methodist Univ., Dallas, TX, USA
  • Volume
    28
  • Issue
    4
  • fYear
    2005
  • Firstpage
    637
  • Lastpage
    643
  • Abstract
    This work presents a demonstration of the applicability and efficacy of an experimental system capable of noninvasively and nondestructively scanning the transient surface temperature of pulsed microelectronic devices with submicron spatial and sub-microsecond temporal resolutions. The article describes the features of the experimental setup, provides details of the calibration process used to map the changes in the measured surface reflectivity to absolute temperature values, and explains the data acquisition procedure used to measure the transient temperature over a given active region. This thermoreflectance thermometry system is shown to be particularly suited for directly measuring the surface temperature field of devices undergoing the fast transients that are typical of next generation microelectronic devices. To illustrate the experimental approach, both quasisteady and transient temperature measurement results are presented for standard MOSFET devices.
  • Keywords
    MOSFET; calibration; data acquisition; temperature measurement; thermometers; thermoreflectance; transient analysis; MOSFET devices; active electronic devices; calibration process; data acquisition procedure; noncontact transient temperature mapping; pulsed microelectronic devices; surface reflectivity; temperature measurement; thermoreflectance thermometry system; transient surface temperature; Calibration; Data acquisition; MOSFET circuits; Measurement standards; Microelectronics; Particle measurements; Reflectivity; Spatial resolution; Temperature measurement; Thermoreflectance; MOSFET devices; thermoreflectance thermometry system;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.859738
  • Filename
    1546167