Title :
Modeling of particle arrangement in an isotropically conductive adhesive joint
Author :
Mündlein, Martin ; Nicolics, Johann
Author_Institution :
Inst. of Sensor & Actuator Syst., Vienna Univ. of Technol., Austria
Abstract :
An isotropically conductive adhesive (ICA) is a composite material consisting of a nonconductive polymer binder and conductive filler particles. When the filler content is high enough the nonconductive binder is transformed into a good electrical conductor. This transition can be described by the percolation theory. We present a two-dimensional model to analyze the principal influences of the geometrical and electrical properties of the filler particles on the percolation threshold and the electrical resistance of an ICA joint. With this model, the arrangement of the particles within the joint is calculated by considering different types of forces. Taking into account the electrical properties of the particles, the electrical contact behavior is investigated. The goal of this study is to provide a deeper understanding of the changes of the macroscopic contact behavior due to different environmental impacts.
Keywords :
adhesives; composite materials; contact resistance; electric properties; electrical contacts; filler metals; percolation; 2D model; composite material; conductive filler particles; contact resistance; electrical conductor; electrical contact behavior; electrical resistance; environmental impact; filler content; isotropically conductive adhesive joint; macroscopic contact behavior; nonconductive binder; nonconductive polymer binder; particle arrangement; percolation theory; Composite materials; Conducting materials; Conductive adhesives; Contact resistance; Electric resistance; Independent component analysis; Polymers; Probability; Solid modeling; Temperature; Contact resistance; isotropically conductive adhesive (ICA); particle arrangement; simulation;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.859671