Mechanical properties for 95.5Sn-3.8Ag-0.7Cu lead-free solder alloy

Mechanical properties for 95.5Sn-3.8Ag-0.7Cu solder alloy were derived from bulk specimen tensile test and lap shear solder joint tests specimen. The tensile tests were carried out at three temperatures (25°C, 75°C, and 125°C) and at three different strain rates (5.6×10^-4 s^-1, 5.6×10^-3 and 5.6×10^-2 s^-1). Shear tests were carried out at three temperatures (25°C, 75°C, and 125°C) and at three different displacement rates (0.5, 0.05, and 0.005 mm/min). The specimen gave the highest strength at the fastest displacement rate and at room temperature of 25°C (0.61 Tm). The lowest strength occurs when the specimen is subjected to the slowest displacement rate at elevated temperature of 125°C (0.81 Tm). Constant-load creep tests for bulk specimen were also conducted at three different temperatures (25°C, 75°C, and 125°C), test results were compared with other reported data.