Title :
Complex Shaped On-Wafer Interconnects Modeling for CMOS RFICs
Author :
Shi, Xiaomeng ; Yeo, Kiat Seng ; Ma, Jian-Guo ; Do, Manh Anh ; Li, Erping
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
fDate :
7/1/2008 12:00:00 AM
Abstract :
A model development methodology for complex shaped on-wafer interconnects is presented. The equivalent circuit of the entire interconnect is obtained by cascading basic subsegment models. The extracted parameters are formulated into empirical expressions. Thus, the proposed model can be easily incorporated with commercial electronic design automation (EDA) tools. The accuracy of the model is validated by the on-wafer measurements up to 20 GHz.
Keywords :
CMOS integrated circuits; electronic design automation; radiofrequency integrated circuits; semiconductor device models; wafer-scale integration; CMOS RFIC; electronic design automation; on-wafer interconnects modeling; on-wafer measurements; Electronic design automation and methodology; Equivalent circuits; Integrated circuit interconnections; Integrated circuit measurements; Parameter extraction; Radio frequency; Radiofrequency integrated circuits; Semiconductor device modeling; Shape; Testing; CMOS radio frequency integrated circuits (RFICs); equivalent circuit model; interconnects; on-wafer measurements;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2008.2000445
