Title :
PCB integrated inductors for low power DC/DC converter
Author :
Ludwig, Matthias ; Duffy, Maeve ; O´Donnell, Terence ; McCloskey, Paul ; Mathuna, Seán Cian Ó
Author_Institution :
Energy Process. for ICT, Nat. Microelectron. Res. Centre, Cork, Ireland
fDate :
7/1/2003 12:00:00 AM
Abstract :
This paper discusses the use of printed circuit board (PCB) integrated inductors for low power DC/DC buck converters. Coreless, magnetic plates and closed core structures are compared in terms of achievable inductance, power handling and efficiency in a footprint of 10 × 10 mm2. The magnetic layers consist of electroplated NiFe, so that the process is fully compatible with standard PCB process. Analytic and finite element method (FEM) methods are applied to predict inductor performance for typical current waveforms encountered in a buck converter. Conventional magnetic design procedures are applied to define optimum winding and core structures for typical inductor specifications. A 4.7 μH PCB integrated inductor with dc current handling of up to 500 mA is presented. This inductor is employed in a 1.5 W buck converter using a commercial control integrated circuit (IC). The footprint of the entire converter measures 10 × 10 mm2 and is built on top of the integrated inductor to demonstrate the concept of integrated passives in power electronic circuits to achieve ultra flat and compact converter solutions.
Keywords :
DC-DC power convertors; finite element analysis; power inductors; power integrated circuits; printed circuits; windings; 1.5 W; 10 mm; 500 mA; NiFe; PCB integrated inductors; closed core structures; control integrated circuit; coreless magnetic plates; electroplated NiFe; finite element method; low power DC/DC power converter; magnetic design procedures; magnetic layers; optimum core structures; optimum winding structures; Buck converters; DC-DC power converters; Finite element methods; Inductance; Inductors; Magnetic analysis; Magnetic cores; Performance analysis; Power measurement; Printed circuits;
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2003.813757