DocumentCode :
747415
Title :
The impact of TiN capping Layer on NiSi, CoSi2, and CoxNi1-xSi2 FUSI metal gate work function adjustment
Author :
Liu, Jun ; Wen, Huang-Chun ; Lu, Jiong-Ping ; Kwong, Dim-Lee
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA
Volume :
52
Issue :
12
fYear :
2005
Firstpage :
2703
Lastpage :
2709
Abstract :
The impact of TiN capping layer on dual work functions of Ni, Co, and Co-Ni fully silicided (FUSI) metal gates was investigated. It was found that the TiN capping layer significantly altered the distribution of both n- and p-dopants during the FUSI process, which in turn changed the work functions of both As-doped and B-doped in the three FUSI metal gate systems. The work function tuning was found to have a linear relationship with the change of dopant level at the silicides/dielectric interface after adding TiN capping layer. The investigation of TiN capping layer on FUSI provided some insights on work function tuning mechanism in FUSI systems. This work also suggested a new methodology for optimizing the nMOS and pMOS work functions for CMOS device applications.
Keywords :
MIS structures; arsenic; boron; cobalt compounds; doping profiles; impurity distribution; nickel compounds; semiconductor doping; titanium compounds; work function; CoSi2:As; CoSi2:B; NiSi:As; NiSi:B; TiN:As; TiN:B; capping layers; dielectric interface; dual work functions; fully silicided metal gates; n-dopant distribution; nMOS structures; p-dopant distribution; silicides; work function adjustment; work function tuning mechanism; Boron; CMOS technology; Dielectric substrates; Electrodes; Instruments; MOS devices; Optimization methods; Silicides; Silicon; Tin; Capping layer; TiN; dopant; dual work function; fully silicided (FUSI); metal gate;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2005.859700
Filename :
1546335
Link To Document :
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