Title :
High-T/sub c/ superconductivity seeks a digital home
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
Two obvious applications of high-T/sub c/ superconductors are discussed: the use of Josephson technology at 77 K and the use of high-T/sub c/ lines for interconnects. The difficulties that must be addressed for each of these is discussed, and the prospects for overcoming them are assessed. The need to achieve full compatibility with polymers is stressed.<>
Keywords :
Josephson effect; high-temperature superconductors; packaging; superconducting junction devices; 77 K; Josephson technology; high temperature superconductors; high-T/sub c/ lines; high-T/sub c/ superconductors; interconnects; Circuits; Consumer electronics; Digital systems; Josephson effect; Josephson junctions; Magnetic separation; SQUIDs; Superconductivity; Technological innovation;
Journal_Title :
Circuits and Devices Magazine, IEEE
