Title :
Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications
Author :
Lim, Michele Hui Fern ; Liang, Zhenxian ; Van Wyk, Jacobus Daniel
Author_Institution :
Center for Power Electron. Syst., Virginia Polytech. Inst. & State Univ., Blacksburg, VA
fDate :
3/1/2007 12:00:00 AM
Abstract :
A novel low profile power inductor suitable for planar integration is designed and fabricated based on low temperature co-fired ceramics technology for microprocessor power delivery applications. The inductor was designed to operate at a switching frequency of 4 to 5MHz, carrying a nominal dc current of 20A with a ripple current of 8 to 10A in a 5-V to 1-V dc-dc converter. The design and fabrication procedure is discussed in this paper, followed by small signal measurement and magnetic characterization results. The inductor was implemented in a prototype converter and the large signal measurement results are presented and its performance evaluated
Keywords :
ceramic packaging; power electronics; power inductors; 1 to 5 V; 20 A; 4 to 5 MHz; 8 to 10 A; LTCC technology; low profile integratable inductor; low temperature co-fired ceramics technology; magnetic characterization; microprocessor power delivery applications; planar integration; power electronics; prototype converter; small signal measurement; Ceramics; DC-DC power converters; Fabrication; Inductors; Microprocessors; Prototypes; Signal design; Switching converters; Switching frequency; Temperature; Inductor; low temperature co-fired ceramics (LTCC); power electronics;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2007.892099
