• DocumentCode
    747875
  • Title

    Simulation and Experimental Study of Laser Hammering for Laser Diode Packaging

  • Author

    Wu, Yulie ; Zhang, Aicheng ; Chun, Jing ; Li, Shengyi

  • Author_Institution
    Dept. of Mechatronics, Nat. Univ. of Defense Technol., Changsha
  • Volume
    30
  • Issue
    1
  • fYear
    2007
  • fDate
    3/1/2007 12:00:00 AM
  • Firstpage
    163
  • Lastpage
    169
  • Abstract
    Laser hammering is a key and effective technique to correct the post-weld-shift in laser welding process. In order to obtain a detailed understanding of the shrinkage deformation principle and magnitude induced by laser Hammering, a finite-element-method (FEM) is employed to analyze the welding shift for the TO-CAN style laser diode package. Detailed relations between welding shift and the beam energy pulse width are obtained. A welding shift measurement system with two noncontact capacitive displacement sensors with high accuracy and high resolution is established. The measurement system can determine the shift direction or deformation angle in real time. The experiment results of this paper will be helpful for the selection of laser beam parameters in the laser hammering process to achieve fast and accurate shift correction
  • Keywords
    electronics packaging; laser beam welding; semiconductor lasers; finite-element-method; laser beam parameters; laser diode packaging; laser hammering; laser welding process; noncontact capacitive displacement sensors; post-weld-shift; Capacitive sensors; Diode lasers; Displacement measurement; Energy resolution; Finite element methods; Laser beams; Packaging; Sensor systems; Space vector pulse width modulation; Welding; Laser diode; laser hammering; laser welding; package; post-weld-shift (PWS);
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2007.892097
  • Filename
    4135413