DocumentCode
747875
Title
Simulation and Experimental Study of Laser Hammering for Laser Diode Packaging
Author
Wu, Yulie ; Zhang, Aicheng ; Chun, Jing ; Li, Shengyi
Author_Institution
Dept. of Mechatronics, Nat. Univ. of Defense Technol., Changsha
Volume
30
Issue
1
fYear
2007
fDate
3/1/2007 12:00:00 AM
Firstpage
163
Lastpage
169
Abstract
Laser hammering is a key and effective technique to correct the post-weld-shift in laser welding process. In order to obtain a detailed understanding of the shrinkage deformation principle and magnitude induced by laser Hammering, a finite-element-method (FEM) is employed to analyze the welding shift for the TO-CAN style laser diode package. Detailed relations between welding shift and the beam energy pulse width are obtained. A welding shift measurement system with two noncontact capacitive displacement sensors with high accuracy and high resolution is established. The measurement system can determine the shift direction or deformation angle in real time. The experiment results of this paper will be helpful for the selection of laser beam parameters in the laser hammering process to achieve fast and accurate shift correction
Keywords
electronics packaging; laser beam welding; semiconductor lasers; finite-element-method; laser beam parameters; laser diode packaging; laser hammering; laser welding process; noncontact capacitive displacement sensors; post-weld-shift; Capacitive sensors; Diode lasers; Displacement measurement; Energy resolution; Finite element methods; Laser beams; Packaging; Sensor systems; Space vector pulse width modulation; Welding; Laser diode; laser hammering; laser welding; package; post-weld-shift (PWS);
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2007.892097
Filename
4135413
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