DocumentCode :
747875
Title :
Simulation and Experimental Study of Laser Hammering for Laser Diode Packaging
Author :
Wu, Yulie ; Zhang, Aicheng ; Chun, Jing ; Li, Shengyi
Author_Institution :
Dept. of Mechatronics, Nat. Univ. of Defense Technol., Changsha
Volume :
30
Issue :
1
fYear :
2007
fDate :
3/1/2007 12:00:00 AM
Firstpage :
163
Lastpage :
169
Abstract :
Laser hammering is a key and effective technique to correct the post-weld-shift in laser welding process. In order to obtain a detailed understanding of the shrinkage deformation principle and magnitude induced by laser Hammering, a finite-element-method (FEM) is employed to analyze the welding shift for the TO-CAN style laser diode package. Detailed relations between welding shift and the beam energy pulse width are obtained. A welding shift measurement system with two noncontact capacitive displacement sensors with high accuracy and high resolution is established. The measurement system can determine the shift direction or deformation angle in real time. The experiment results of this paper will be helpful for the selection of laser beam parameters in the laser hammering process to achieve fast and accurate shift correction
Keywords :
electronics packaging; laser beam welding; semiconductor lasers; finite-element-method; laser beam parameters; laser diode packaging; laser hammering; laser welding process; noncontact capacitive displacement sensors; post-weld-shift; Capacitive sensors; Diode lasers; Displacement measurement; Energy resolution; Finite element methods; Laser beams; Packaging; Sensor systems; Space vector pulse width modulation; Welding; Laser diode; laser hammering; laser welding; package; post-weld-shift (PWS);
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2007.892097
Filename :
4135413
Link To Document :
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