DocumentCode :
747887
Title :
Contact Resistance Estimation for Time-Dependent Silicone Elastomer Matrix of Land Grid Array Socket
Author :
Yang, Shuang ; Wu, Ji ; Tsai, Derek ; Pecht, Michael G.
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD
Volume :
30
Issue :
1
fYear :
2007
fDate :
3/1/2007 12:00:00 AM
Firstpage :
81
Lastpage :
85
Abstract :
A land grid array (LGA) socket provides high-density, electrically-separable interconnect between a component and a printed circuit board. The LGA socket must not be susceptible to creep and stress relaxation, which can lead to loss of contact force and consequently the degradation of contact resistance. In this paper, the time-dependent contact resistance failure mechanisms were experimentally assessed and theoretically analyzed for silicone elastomer matrix socket interconnects. A time-dependent physics-of-failure model was developed for contact resistance simulation
Keywords :
ball grid arrays; contact resistance; elastomers; electric connectors; interconnections; LGA socket; contact resistance estimation; contact resistance failure mechanisms; land grid array socket; physics-of-failure model; printed circuit board; silicone elastomer matrix socket interconnects; time-dependent silicone elastomer matrix; Contact resistance; Creep; Degradation; Failure analysis; Integrated circuit interconnections; LAN interconnection; Printed circuits; Sockets; Stress; Transmission line matrix methods; Contact force; contact resistance; creep; land grid array (LGA); socket; stress relaxation;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2007.892075
Filename :
4135414
Link To Document :
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