• DocumentCode
    748258
  • Title

    Radiation effects on p+ poly gate MOS structures with thin oxides

  • Author

    Yoshii, I. ; Hama, K. ; Maeguchi, K.

  • Author_Institution
    Toshiba Corp., Kawasaki, Japan
  • Volume
    36
  • Issue
    6
  • fYear
    1989
  • fDate
    12/1/1989 12:00:00 AM
  • Firstpage
    2124
  • Lastpage
    2130
  • Abstract
    The effects of radiation on p+ poly gate MOS structures with thin (25-10 nm) oxides are investigated and compared with those on n+ poly gate MOS structures using a high-frequency C-V technique. It is found that the characteristics of the oxide charge buildup and the interface state generation are different for n+ and p+ poly gates. The results indicate that the differences are due to boron atoms penetrating to the gate oxide from the polysilicon gate. On the basis of these observations, a model for the role of boron atoms in the oxide is proposed. In the model, boron atoms in the bulk of the oxide act as electron-hole recombination centers which reduce the number of holes available for trapping, and boron atoms at the interface, which may form B-Si bonds, cause the interface state generation
  • Keywords
    electron-hole recombination; interface electron states; metal-insulator-semiconductor devices; radiation effects; 10 to 25 nm; MOS capacitors; Si-SiO2; Si:B; electron-hole recombination centers; high-frequency C-V technique; interface state generation; n+ poly gate MOS structures; oxide charge buildup; p+ poly gate MOS structures; radiation effects; semiconductor; Annealing; Atomic layer deposition; Atomic measurements; Boron; Interface states; MOS capacitors; MOS devices; Radiation effects; Semiconductor device modeling; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.45414
  • Filename
    45414