Title :
ELO SOI technology for radiation hard devices
Author :
Liu, S.T. ; Lai, J. ; Fechner, P. ; Holt, M.
Author_Institution :
Honeywell Inc., Plymouth, MN, USA
fDate :
12/1/1989 12:00:00 AM
Abstract :
It is demonstrated experimentally that thin SOI structures with a predetermined oxide pattern can be made by ELO (epitaxial lateral overgrowth) technology and etchback. It is also demonstrated experimentally that these ELO SOI structures can support MOS devices to a reasonably high level of radiation. At a total dose of 106 rad(SiO2), the threshold voltage shift was only -0.17 V, the subthreshold slope change was only 16 mV/decade, and degradation of saturated transconductance was only 4%. At 1×107 rad(SiO2), the threshold voltage shift was -0.25 V, the subthreshold slope change was 50 mV/decade, and degradation of saturated transconductance was 18%. This degradation and hence degradation of the device performance at high total dose is due to interface state buildup as a result of irradiation
Keywords :
X-ray effects; insulated gate field effect transistors; interface electron states; radiation hardening (electronics); semiconductor epitaxial layers; semiconductor growth; semiconductor-insulator boundaries; 1E6 to 1E7 rad; ELO SOI technology; MOS devices; SOI structures; Si-SiO2; X-ray effects; degradation; epitaxial lateral overgrowth; etchback; interface state buildup; radiation hard devices; saturated transconductance; subthreshold slope change; threshold voltage shift; total dose; CMOS technology; Epitaxial growth; Etching; Fabrication; Hydrogen; Isolation technology; MOSFETs; Silicon on insulator technology; Temperature distribution; Temperature sensors;
Journal_Title :
Nuclear Science, IEEE Transactions on