Title :
Fabrication and thermal stability characterisation of Ru electrode used for high power contact radio frequency microelectromechanical system switch
Author :
Hongze Zhang ; Wei Wang ; Zhihong Li
Author_Institution :
Nat. Key Lab. of Nano/Micro Fabrication Technol., Peking Univ., Beijing, China
Abstract :
Reported are the fabrication and thermal stability of an Ru electrode, which is used for a high power Ru-Au contact radio frequency microelectromechanical system switch with a microspring contact design. In this reported work, a new process with bilayer lift-off and a strain release layer is developed, thereby acquiring the 3000 Å Ti/Au/Ru electrode with excellent smooth edges for high-power handling capacity and low loss. Furthermore, thermal tests under 400, 500 and 600°C for over 1 h have been performed. Investigation of the surface with scanning electron microscopy and energy dispersive X-ray spectroscopy shows that the electrode has a good thermal stability at 400°C, which is proper for high-power handling. The cold switch DC current handling capacity is advanced from <;90 mA per point (failed) to 100 mA per point (still working).
Keywords :
X-ray chemical analysis; electrical contacts; electrochemical electrodes; gold; microfabrication; micromechanical devices; ruthenium; scanning electron microscopy; thermal stability; titanium; Ti-Au-Ru; bilayer lift-off layer; cold switch DC current handling capacity; electrode; energy dispersive X-ray spectroscopy; high power contact radiofrequency microelectromechanical system switching; high-power handling; high-power handling capacity; microspring contact design; smooth edges; strain release layer; surface scanning electron microscopy; temperature 400 degC; temperature 500 degC; temperature 600 degC; thermal stability characterisation; thermal testing; time 1 h;
Journal_Title :
Micro & Nano Letters, IET
DOI :
10.1049/mnl.2013.0300