Title :
Densely packed optoelectronic interconnect using micromachined springs
Author :
Chua, C.L. ; Fork, D.K. ; Hantschel, T.
Author_Institution :
Xerox Palo Alto Res. Center, CA, USA
fDate :
6/1/2002 12:00:00 AM
Abstract :
We demonstrate a novel optoelectronic packaging technology interconnecting 200 element independently addressable vertical-cavity surface-emitting laser arrays on 6-μm pitch to silicon driver chips with equally dense output lines. The room-temperature flip-chip process utilizes micromachined cantilevers for establishing electrical contact. Thermal cycling and thermal shock tests show excellent package reliability.
Keywords :
flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated optoelectronics; micromachining; optical interconnections; semiconductor laser arrays; surface emitting lasers; thermal shock; 200 element; 6 micron; Si; densely packed optoelectronic interconnect; electrical contact; equally dense output lines; excellent package reliability; independently addressable vertical-cavity surface-emitting laser arrays; micromachined cantilevers; micromachined springs; optoelectronic packaging technology; room-temperature flip-chip process; silicon driver chips; thermal cycling; thermal shock tests; Atomic layer deposition; Contacts; Optical arrays; Semiconductor device packaging; Semiconductor laser arrays; Springs; Stress; Substrates; Surface emitting lasers; Vertical cavity surface emitting lasers;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2002.1003113
