On the interior resonance problem when applying a hybrid FEM/MoM approach to model printed circuit boards

Author

Ji, Yun ; Hubing, Todd H.

Author_Institution

Desktop Archit. Lab, Intel Corp., Hillsboro, OR, USA

Volume

44

Issue

2

fYear

2002

fDate

5/1/2002 12:00:00 AM

Firstpage

318

Lastpage

323

Abstract

A hybrid finite element method/method of moments (FEM/MoM) technique is used to analyze a printed circuit board power bus structure where the source and observation points are in the near field. The FEM is used to model the lossy region between the planes of the board including the source. The MoM is used to model the region outside the planes and provide a radiation boundary condition to terminate the FEM mesh. Numerical results for a bridged power bus structure are compared with measurements. A nonphysical interior resonance of the electric field integral equation is observed. The problem can be avoided by using a hybrid technique based on a combined field integral equation

Keywords

electric field integral equations; finite element analysis; magnetic field integral equations; method of moments; printed circuits; resonance; EFIE; FEM mesh termination; MFIE; PCB model; PCB power bus structure; bridged power bus structure; combined field integral equation; electric field integral equation; hybrid FEM/MoM; hybrid finite element method/method of moments; interior resonance problem; lossy region; near field; nonphysical interior resonance; printed circuit boards; radiation boundary condition; scattering parameters; Boundary conditions; Electromagnetic modeling; Electromagnetic scattering; Finite element methods; Frequency; Integral equations; Maxwell equations; Message-oriented middleware; Printed circuits; Resonance;

fLanguage

English

Journal_Title

Electromagnetic Compatibility, IEEE Transactions on

Publisher

ieee

ISSN

0018-9375

Type

jour

DOI

10.1109/TEMC.2002.1003396

Filename

1003396