Title :
Thermal characterization of a Tape Carrier Package
Author :
Pope, D. Elaine ; DO, Houng Thu
Author_Institution :
Intel Corp., Chandler, AZ, USA
fDate :
3/1/1995 12:00:00 AM
Abstract :
The unenhanced thermal performance of 20 mm Tape Carrier Packages (TCP) packages on 8 layer boards with internal planes is 19°C/W. Package thermal resistance Θjc has been measured at 2°C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heat sinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with power dissipation requirement of 5°C/W and higher can be packaged in TCP format
Keywords :
cooling; forced convection; heat sinks; packaging; printed circuits; thermal resistance; 20 mm; PCB; Tape Carrier Package; forced convection cooling; heat sinks; internal planes; mobile computing platforms; multilayer boards; power dissipation; thermal performance; thermal resistance; thermal vias; Cooling; Electrical resistance measurement; Force measurement; Heat sinks; Mobile computing; Packaging; Power dissipation; Resistance heating; Thermal force; Thermal resistance;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
