Thermal characterization of a Tape Carrier Package

Author

Pope, D. Elaine ; DO, Houng Thu

Author_Institution

Intel Corp., Chandler, AZ, USA

Volume

18

Issue

1

fYear

1995

fDate

3/1/1995 12:00:00 AM

Firstpage

75

Lastpage

81

Abstract

The unenhanced thermal performance of 20 mm Tape Carrier Packages (TCP) packages on 8 layer boards with internal planes is 19°C/W. Package thermal resistance Θ_jc has been measured at 2°C/W. Simple PCB enhancements such as the addition of thermal vias, alone or with the use of low profile heat sinks, brings the thermal performance in line with requirements for mobile computing platforms which do not have forced convection cooling options available. With forced convection cooling, devices with power dissipation requirement of 5°C/W and higher can be packaged in TCP format

Keywords

cooling; forced convection; heat sinks; packaging; printed circuits; thermal resistance; 20 mm; PCB; Tape Carrier Package; forced convection cooling; heat sinks; internal planes; mobile computing platforms; multilayer boards; power dissipation; thermal performance; thermal resistance; thermal vias; Cooling; Electrical resistance measurement; Force measurement; Heat sinks; Mobile computing; Packaging; Power dissipation; Resistance heating; Thermal force; Thermal resistance;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.370738

Filename

370738